Room 901-2, 9th Floor, Block C
No.1 Yongshuiqiao Science and Technology Innovation Center
315000 Ningbo City, Zhejiang Province
China
Tel.: +86 0574-87252670
E-mail: hi@passive-edge.cn
Web: https://www.passive-edge.cn

Company profile

PASSIVE EDGE TECH is a new materials technology company specializing in thermal ‎management and thermal energy storage, and we are dedicated to developing 10x energy ‎efficiency solutions, using advanced phase change material (PCM) technology and ‎nano-encapsulation technology to drive sustainable energy transformation.‎ Our founding team, composed of U.S.-educated PhDs with over 20 years of industry ‎experience, brings deep expertise and global perspective.

We provide high-performance Phase Change Materials (PCM), both organic, inorganic and ‎compound, with an extended operating temperature range from -80 °C to +300 °C. Our two core technologies, both listed in the WIPO Green Technology Database, include:‎

1)MOFPoly PCM (Nanoencapsulated Phase Change Materials)
Utilizing cutting-edge ‎MOFPoly microencapsulation technology to form leak-proof core-shell particles. The PCM is ‎fully enclosed within a durable outer shell, ensuring reliability. This technology meets a wide ‎range of thermal management application needs, including but not limited to liquid cooling, ‎textiles, and temperature control solutions for electronic devices.‎

Temperature range:-20~ +120 °C‎

Temperature range:-20~ +120 °C‎

‎2)UltraST PCM(Ultra-high Thermal Conductivity Shape-Stabilized Phase Change Material)
Overcomes the low thermal conductivity and limited cycle life of conventional phase change ‎materials, while eliminating the potential environmental and health risks associated with ‎fluorinated surface treatments during conventional PCM packaging. It is ideal for ‎applications in industrial and commercial energy storage, building energy efficiency, cold ‎chain logistics & storage, and residential thermal management.‎‎

Temperature range:-80~ +300 °C‎

Temperature range:-80~ +300 °C‎

Our PCM technologies are designed for four primary sectors: Data centers & chip cooling, ‎Home & textiles, Cold chain (storage and transportation), and Building thermal ‎management and energy storage (cold and heat).‎

a) Home & Textiles‎
Compared to conventional contact cooling or instant-cooling fabrics, textiles embedded ‎with MOFPoly PCM provide long-lasting thermal comfort. With nano mircocapsules, ‎MOFPoly PCM can be incorporated into the textile during fiber processing or ‎post-treatment (e.g., printing or coating), to deliver “cool in summer, warm in winter” ‎functionality.

MOFPoly PCM printed/knit/woven fabric‎

MOFPoly PCM printed/knit/woven fabric ‎‎

In home applications, UltraST PCM extends cooling duration to 30+ minutes, offering ‎full-day comfort that surpasses traditional instant cooling solutions.‎

Deepcool Gel‎‎

Deepcool Gel‎

‎(b) Cold chain logistics (storage and transportation)‎‎
UltraST PCM thermal modules deliver precise and efficient temperature control.‎
In transportation & storage, compared to conventional packs, they offer faster charging ‎‎(1/3 of the time), higher conductivity, extended life cycles, and more accurate ‎temperature regulation, more friendly to human health and environment.

UltraST PCM Temperature control Module‎

UltraST PCM Temperature control Module‎‎‎

Deepcool Gel‎‎

c) Building thermal management and energy storage (cold and heat)‎‎
UltraST PCM modules integrated into wall assemblies provide passive indoor temperature ‎regulation, maintaining a narrower and more stable thermal range. This reduces HVAC ‎cycling and energy consumption by 20–35%. Combined with renewable energy systems ‎such as solar and wind, UltraST PCM delivers thermal storage solutions with over four ‎times the efficiency of conventional cold/heat storage systems, supporting industrial and ‎commercial energy sustainability.‎

UltraST PCM Temperature control Module‎

UltraST PCM Temperature control Module

UltraST PCM Temperature control Module

UltraST PCM Temperature control Module

‎(d) Data Centers & Chip Cooling‎‎‎
As the AI and AIGC era drives unprecedented computing demand, conventional air and ‎liquid cooling methods face limitations. Passive Edge’s Ultra-high thermal conductivity ‎nanofluid lower chip temperatures by approximately 16 °C, enhancing performance, ‎stability, and overall computing power.‎

UltraST PCM Temperature control Module‎